| 发明名称 |
Reduced thickness semiconductor device with IC packages mounted in openings on substrate |
| 摘要 |
A semiconductor device of the present invention enables mounting with a reduced thickness and a high density. IC packages (17) are mounted in each opening (12) on both surfaces of a substrate (11) in such a way that package bodies (18) are half accommodated in the opening (12) formed in the substrate (11).
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| 申请公布号 |
US5744862(A) |
申请公布日期 |
1998.04.28 |
| 申请号 |
US19960753094 |
申请日期 |
1996.11.20 |
| 申请人 |
MITSUBISHI DENKI KABUSHIKI KAISHA |
发明人 |
ISHII, HIDEKI |
| 分类号 |
H01L25/10;H05K1/14;H05K1/18;H05K3/34;H05K3/36;(IPC1-7):H01L23/36;H01L25/04;H01L23/02;H01L23/12 |
主分类号 |
H01L25/10 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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