发明名称 Multi-layer film capacitor structures and method
摘要 A multi-layer film capacitor structure has a bottom electrode layer on a monolithic substrate, intermediate pairs of layers of film electrode and dielectric material overlying the bottom electrode, and a top pair of layers of a film electrode and film dielectric overlying the intermediate pairs. The structure preferably has a mesa configuration, in which each electrode layer extends laterally beyond the periphery of the layers above it around the entire periphery of the device. Each electrode layer therefore has a top surface which is accessible at its projecting edge through a via, so that the electrodes can be accessed in any combination to permit any desired circuit connection. If desired the dielectric materials can have different frequency characteristics, allowing a single capacitor structure to be optimized for a filter. Either the bottom electrode or the top electrode or both can be grounded and capacitor connections can be made to intermediate layers, to reduce parasitic capacitance effects.
申请公布号 US5745335(A) 申请公布日期 1998.04.28
申请号 US19960671057 申请日期 1996.06.27
申请人 GENNUM CORPORATION 发明人 WATT, MICHAEL MAN-KUEN
分类号 H01G4/38;H01G4/232;H01G4/30;H01L21/02;H01L21/822;H01L27/04;H01L27/08;(IPC1-7):H01G4/06;H01G4/228 主分类号 H01G4/38
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