| 摘要 |
A semiconductor device includes a heat radiator having thereon a semiconductor die and an insulating tape. The semiconductor die has pads thereon. Support leads are integral with and support the heat radiator. Inner leads are secured to the heat radiator with the insulating tape intervening therebetween. Outer leads are integral with the inner leads. Bonding wires connect the inner leads to the pads on the semiconductor die. A resin sealer seals the semiconductor die, the heat radiator, the inner leads and the bonding wires. Heat generated in the semiconductor die is dissipated not only from the heat radiator, but also through the support leads 5 and inner leads 3A integral with the heat radiator. |
