| 摘要 |
PROBLEM TO BE SOLVED: To allow a sealing edge to approach up to the limit of a mounting part to make the seal part small while easily ensuring edge accuracy on the side of a non-heating element to further miniaturize a thermal head by providing a separating and cutting surface to at least a part of a seal part. SOLUTION: A heating element 2 is formed on a substrate 7 and the IC 5 driving this heating element is mounted in a face down system so that the surface of the element is turned toward the substrate 7. Further, a seal part 6 protecting an IC mounting part is formed. A frame is not provided to the seal part 6 and the seal part 6 has a shape of the foot of a gentle mountain caused by the natural flow-out of a sealing resin on the side of the heating element 2. A non-heating element side 6c has a cliff shape and this cliff shape part almost coincides with the edge of the substrate 7. That is, the seal part 6 does not protrude to the outside of the substrate 7. By performing cliff processing as mentioned above, the edges of the IC 5 and the substrate 7 can be allowed to approach each other. |
