| 摘要 |
PROBLEM TO BE SOLVED: To produce copper alloy for electronic equipment suitable for a multipin lead frame or the like. SOLUTION: This copper alloy for electronic equipment is the one having a compsn. contg., by weight, 0.4 to 4.0% Ni and 0.1 to 1.0% Si, contg. one or >= two kinds selected from 0.05 to 1.5% Zn, 0.01 to 0.5% Mg, 0.01 to 0.5% Mn and 0.001 to 0.3% Ag by 0.001 to 1.5% in total, moreover contg. one or more kinds selected from Pb, Bi, In, Sb, Ca, Te, P, Ba and rare earth elements by 0.002 to 0.2% in total, in which the contents of S and O2 are regulated to <0.005%, and the balance Cu with inevitable impurities. In this case, the dimension of crystallized products or precipitates in the copper alloy is regulated to <3μm, and the grain size is regulated to <10μm.
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