发明名称 RESIN-SEALING AND MOLDING DEVICE FOR ELECTRONIC COMPONENT, AND RESIN TABLET
摘要 PROBLEM TO BE SOLVED: To efficiently prevent a defect such as a chip, etc., which occur in a resin tablet and resin powder when resin-sealing and molding an electronic component with a resin tablet, and also, prevent different kinds of resin tablets from mixing in. SOLUTION: The resin tablet supply means 30 of this device has a main body equipped with a resin-sealing and molding part and a coupling equipped with a resin sealing and molding part installed freely of mounting and removal to this main body. In this case, different kinds of resin tablets 4 are supplied, being taken out in order and besides steadily, according to each sort, by supplying packages 40 severally to a tape stripping mechanism 34 from the reels 33, which have severally wound the resin tablet packages 40 being constituted by accommodating and packing different kinds of resin tablets 4, according to each kind, in tapes 41 and 42, and by compulsively tearing off the two sheets of tapes 41 and 42 of the resin tablet packing 40.
申请公布号 JPH10112466(A) 申请公布日期 1998.04.28
申请号 JP19960283185 申请日期 1996.10.04
申请人 TOWA KK 发明人 HIDAKA TETSUO;HORIUCHI KAZUO
分类号 B29C45/02;B29C45/18;B29C45/46;B29L31/34;H01L21/56;(IPC1-7):H01L21/56 主分类号 B29C45/02
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