Capacitor formed within printed circuit board

摘要

A multi-layer printed circuit board comprises a first metallic layer, a first Ta or Hf layer on one face of the first metallic layer, a first layer of Ta2O5 or HfO on a face of the Ta or Hf layer opposite the first metallic layer, a second metallic layer on the Ta2O5 or HfO layer opposite the Ta or Hf layer, a first dielectric layer on the first metallic layer opposite the Ta of Hf layer, and a second dielectric layer on the second metallic layer opposite the Ta2O5 or HfO layer. A multi-layer printed circuit board is formed by adding the following layers to form the second capacitor. A third metallic layer on said second dielectric layer, a second Ta or Hf layer on a face of the third metallic layer, a second Ta2O5 or HfO layer on a face of the second Ta or Hf layer opposite the third metallic layer, a fourth metallic layer on the second Ta2O5 or HfO layer opposite the second Ta or Hf layer, and a third dielectric layer on the fourth metallic layer opposite the second Ta2O5 or HfO layer.