Aluminum nitride sintered body with high thermal conductivity and its preparation

摘要

PCT No. PCT/US94/04256 Sec. 371 Date Dec. 7, 1995 Sec. 102(e) Date Dec. 7, 1995 PCT Filed Apr. 18, 1994 PCT Pub. No. WO95/02563 PCT Pub. Date Jan. 26, 1995An aluminum nitride sintered product with a high thermal conductivity (at least 100 W/m.K) can be prepared at a sintering temperature of less than 1850 DEG C. (often less than 1650 DEG C.) using a sinterable combination of aluminum nitride powder with at least three sintering aids. The sintering aids include a source of a rare earth metal oxide, a source of an alkaline earth metal oxide, a boron source and, optionally, a source of aluminum oxide. The sinterable combinations may also be used to prepare cofired, multilayer substrates.