发明名称 |
Adhesive composition for bonding a semiconductor device |
摘要 |
Described is an adhesive composition suitable for bonding a semiconductor device to a substrate comprising about 60-90 wt. % particulate silver; about 10-40 wt. % of an adhesive material comprising at least one nonelectrically conductive organic compound; and a filler comprising at least one electrically conductive organic compound capable of forming a conductivity bridge between silver particles. The adhesive composition may additionally include at least one curing catalyst for the adhesive material, a flexibilizer to render the composition more flexible, a surfactant to facilitate contact with a substrate and/or a material to aid in adjusting the rheology of the composition.
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申请公布号 |
US5744533(A) |
申请公布日期 |
1998.04.28 |
申请号 |
US19970868508 |
申请日期 |
1997.06.04 |
申请人 |
JOHNSON MATTHEY, INC. |
发明人 |
IWAMOTO, NANCY E.;PEDIGO, JESSE L.;LI, SHAO WEI;GRIEVE, ALAN |
分类号 |
C09J201/00;(IPC1-7):C08K3/00 |
主分类号 |
C09J201/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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