发明名称 Electroplating apparatus
摘要 In a method for high-speed electrolytic-deposition of metallic layers on ribbon or cord-like strips, the strips which are electrically connected to the negative side of an electric DC power source are moved through a hollow guide rail containing an electrolyte solution and past an anode structure arranged within the hollow guide rail and connected to the positive side of the DC power source. An electrolyte solution circulating conduit structure including a circulating pump is connected to opposite ends of the guide rail and, while the metal is deposited on the strip which is moved through the guide rail in one direction, the electrolyte solution is circulated through the guide rail in the opposite direction at a speed which provides for a Reynolds No. of over 80,000 with regard to the relative strip speed in the electrolyte solution so as to provide turbulent flow conditions adjacent the strip surface which greatly increase the electrolyte deposition rates. The hollow guide rail is preferably arranged vertically with the strip moving upwardly and the electrolyte solution flowing downwardly through the guide rail.
申请公布号 US4721554(A) 申请公布日期 1988.01.26
申请号 US19860926818 申请日期 1986.10.31
申请人 INOVAN-STROEBE GMBH & CO. KG. 发明人 SAUTER, ERWIN A.
分类号 C25D5/08;C25D7/06;(IPC1-7):C25D7/06;C25D17/10 主分类号 C25D5/08
代理机构 代理人
主权项
地址