发明名称 |
Multiple focal plane image comparison for defect detection and classification |
摘要 |
An apparatus and method of analyzing particles on an integrated circuit wafer using a quasi three dimensional image analysis of the particles. The apparatus includes an optical system which has an optical axis and forms an image of that part of a focal plane which within a field distance of the optical axis. The apparatus holds a wafer perpendicular to the optical axis and allows the surface of the wafer to be moved in a plane perpendicular to the optical axes to view the entire surface of the wafer. The apparatus also allows the surface of the wafer to be moved a step distance below the focal plane. Images formed at a number of step distances are used to form a quasi three dimensional image of particles on the surface of the wafer. Automatic image analysis is used when appropriate.
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申请公布号 |
US5745239(A) |
申请公布日期 |
1998.04.28 |
申请号 |
US19970826713 |
申请日期 |
1997.04.07 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY |
发明人 |
CHEN, BOR-CHENG;WANN, YEH-JYE |
分类号 |
G01N21/94;G01N21/95;(IPC1-7):G01B11/28 |
主分类号 |
G01N21/94 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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