| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a substrate holder and a substrate cooling method which can make a uniform cooling of a whole surface of a substrate in such a device as an ion milling. SOLUTION: A substrate W is cooled by storing cooling gas in a gap part 10 of a substrate holder 1. A gas supplying groove 12 is provided at a region between an O-ring 2 and the gap part 10 so as to surround the gap part 10. Gas supplying ports 13 are provided at each portion of the gas supplying groove 12, and the cooling gas is made to flow in from the ports. Most of the cooling gas made to flow in from the gas supplying ports 13 once spreads at the inner part of the gas supplying groove 12, and after that it enters the gap part 10 through the slit 120. That is, the cooling gas is introduced at the near part of easily leaking of gas (especially at more inside position than the part of easily leaking of gas). A gas exhausting port 15 is provided at the center of the gap part 10. Pressure adjustment of the cooling gas is performed at both sides of cooling gas supplying and exhausting.</p> |
