发明名称 |
METHOD OF CUTTING OF SEMICONDUCTOR INGOTS INTO PLATES BY DIAMOND CUT-OFF WHEEL WITH INTERNAL CUTTING EDGE |
摘要 |
FIELD: production of substrates of semiconductor materials at operations of cutting of ingots of these materials into plates. SUBSTANCE: the method involves attachment and tightening of the wheel on the drum, rotation of the latter about its axis, introduction of ingot in the hole of the cut-off wheel at a distance equal to the sum of the specified thickness of the plate and the cut width, rectilinear motion of ingot onto the cutting edge of the rotating wheel with cutting-off of a plate from ingot at feeding of water lubricant - coolant to the cutting zone, and withdrawal of ingot to the initial position. Prior to cutting-off of each plate, oil magnetic fluid is fed to the cutting edge of the cut-off wheel with simultaneous superposition of magnetic field on it. EFFECT: enhanced efficiency. 4 dwgi
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申请公布号 |
RU2109631(C1) |
申请公布日期 |
1998.04.27 |
申请号 |
RU19950109471 |
申请日期 |
1995.06.06 |
申请人 |
UL'JANOVSKIJ GOSUDARSTVENNYJ TEKHNICHESKIJ UNIVERS |
发明人 |
KHUDOBIN L.V.;KRUPENNIKOV O.G.;KHUDOBIN L.V.;KRUPENNIKOV O.G. |
分类号 |
B28D1/04;(IPC1-7):B28D1/04 |
主分类号 |
B28D1/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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