| 摘要 |
A wafer transferring apparatus for transferring a plurality of wafers from a first carrier to a second carrier, while the materials are maintained in their predetermined upright arrangement parallel to each other at a predetermined pitch. Each of the first and second carriers accommodates the wafers in a predetermined upright arrangement. A transporting section has a supporting member providing with a plurality of guide grooves arranged at a pitch the same as the predetermined pitch for moving the plurality of wafers up and down between a lowered position and a raised position. The guide grooves of the supporting member are engaged with upper peripheral portions of the respective wafers when the wafers are moved upward or downward. A holding section temporarily holds the plurality of wafers when the plurality of wafers are in their raised position. An inclination restricting member is provided with guide grooves for restricting the upper peripheral portions of the respective wafers to prevent the wafers being inclined when the wafers are moved upward or downward.
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