发明名称 Heat insulating board and method for heat insulation by using the same
摘要 PCT No. PCT/JP94/01459 Sec. 371 Date Feb. 22, 1996 Sec. 102(e) Date Feb. 22, 1996 PCT Filed Sep. 2, 1994 PCT Pub. No. WO95/06839 PCT Pub. Date Mar. 9, 1995A heat insulating board and a method for heat insulation by utilizing the same based on a novel heat-insulation theory utilizing a heat gradient. And, this heat insulating board is characterized by consisting of a composite body of an opaque heat-conducting base body positioned to face the low temperature zone and a heat conductive transparent layer positioned to face the high temperature zone, the said transparent layer having a heat volume and an absorption of heat of radiation smaller than the heat volume and absorption of heat of radiation of the said base body.
申请公布号 US5744225(A) 申请公布日期 1998.04.28
申请号 US19960600976 申请日期 1996.02.22
申请人 KABUSHIKI KAISHA SEKUTO KAGAKU 发明人 KUJIRAI, YUMIKO;KUJIRAI, MASAMI;KUJIRAI, YUKIO
分类号 F28F3/00;F16L59/08;F28F13/18;F28F21/00;H01L23/373;(IPC1-7):B32B9/00 主分类号 F28F3/00
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