发明名称 |
Heat insulating board and method for heat insulation by using the same |
摘要 |
PCT No. PCT/JP94/01459 Sec. 371 Date Feb. 22, 1996 Sec. 102(e) Date Feb. 22, 1996 PCT Filed Sep. 2, 1994 PCT Pub. No. WO95/06839 PCT Pub. Date Mar. 9, 1995A heat insulating board and a method for heat insulation by utilizing the same based on a novel heat-insulation theory utilizing a heat gradient. And, this heat insulating board is characterized by consisting of a composite body of an opaque heat-conducting base body positioned to face the low temperature zone and a heat conductive transparent layer positioned to face the high temperature zone, the said transparent layer having a heat volume and an absorption of heat of radiation smaller than the heat volume and absorption of heat of radiation of the said base body.
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申请公布号 |
US5744225(A) |
申请公布日期 |
1998.04.28 |
申请号 |
US19960600976 |
申请日期 |
1996.02.22 |
申请人 |
KABUSHIKI KAISHA SEKUTO KAGAKU |
发明人 |
KUJIRAI, YUMIKO;KUJIRAI, MASAMI;KUJIRAI, YUKIO |
分类号 |
F28F3/00;F16L59/08;F28F13/18;F28F21/00;H01L23/373;(IPC1-7):B32B9/00 |
主分类号 |
F28F3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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