发明名称 CERAMIC WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To improve surface insulation resistance and to prevent the propagation loss of a signal at a high-frequency band from being generated by forming a ceramic substrate with a non-oxide ceramic substrate and making specific the surface roughness. SOLUTION: A layer 2 made of at least one type of metal out of titanium and chrome is provided on the surface of a ceramic substrate 1, and further a copper layer 3 is laminated on it. A non-oxide ceramic substrate, such as an aluminum nitride substrate, is used as the ceramic substrate. By setting the surface roughness of the ceramic board 1 to less than 1μm at Rmax, surface insulation resistance can be increased and the propagation loss of a signal at a high-frequency band can be prevented. When the surface roughness is 1μm or greater, a propagation loss is generated when a signal at a high-frequency band is propagated and the layer 2 and the copper layer 3 made of at least one type of metal out of titanium and chrome remains on the surface of the ceramic board 1 when performing etching, thus reducing the surface insulation resistance of the ceramic board 1.
申请公布号 JPH10107393(A) 申请公布日期 1998.04.24
申请号 JP19960277275 申请日期 1996.09.26
申请人 IBIDEN CO LTD 发明人 HIRAMATSU YASUJI;ITO YASUTAKA;IDO YOSHIYUKI
分类号 H05K1/09;H05K1/03;H05K3/24;H05K3/38;(IPC1-7):H05K1/09 主分类号 H05K1/09
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