| 发明名称 |
Cerium oxide abrasive and method of abrading substrates |
| 摘要 |
This invention relates to a cerium oxide abrasive and a method of polishing substrates. The present invention provides a cerium oxide 1 abrasive that can polish the surfaces of objects such as SiO 2 insulating films without causing scratches and at a high rate, and also provides a method of polishing substrates. |
| 申请公布号 |
AU4323197(A) |
申请公布日期 |
1998.04.24 |
| 申请号 |
AU19970043231 |
申请日期 |
1997.09.30 |
| 申请人 |
HITACHI CHEMICAL COMPANY, LTD. |
发明人 |
MASATO YOSHIDA;TORANOSUKE ASHIZAWA;HIROKI TERASAKI;YASUSHI KURATA;JUN MATSUZAWA;KIYOHITO TANNO;YUUTO OOTUKI |
| 分类号 |
B24B37/00;C09C1/68;C09G1/02;C09K3/14;H01L21/304;H01L21/3105;H01L21/321 |
主分类号 |
B24B37/00 |
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