| 摘要 |
<p>PROBLEM TO BE SOLVED: To realize a wafer holder which produces no reaction product reacting on corrosive gas and is capable of lessening particles attached to a wafer, by a method wherein the top surface and inner wall surface of a ceramic plate which is formed nearly like a ring and holds the periphery edge of a semiconductor wafer are coated with a heat-resistant resin film. SOLUTION: A wafer holder is formed of a ceramic plate 1 which is formed nearly like a ring and holds the periphery edge of a semiconductor wafer 20, and the top surface 1a and inner wall surface 1c of the ceramic plate 1 are coated with a heat-resistant resin film 5. For instance, the ceramic plate 1 is provided with an opening 2 at its center and a first recess 3a which is formed for communicating with the opening 2 and for conforming to the outer shape of the wafer 20. Furthermore, the ceramic plate 1 is provided with a second recess 3b, which is formed for communicating with the recess 3a and for conforming to the outer shape of a mount, and a stepped part 4 at its peripheral part. The plate 1 is formed of ceramic, and the top surface 1a and inner and outer wall surface of the plate 1 are coated with a heat-resistant resin film 5.</p> |
