| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a bonded body of glass and a semiconductor in which a crack does not reach a region for forming a bonding pad (W/B pad) and the W/B pad is not stripped off. SOLUTION: An external lead-out electrode part 7 is formed on a glass substrate 1 constituting a pressure sensor and a W/B pad 8, which is a size smaller than the external lead-oat electrode part 7, is formed thereon. Circumferential part of the external lead-out electrode part 7 is exposed and a groove 15 is made in the exposed region between a dicing line and a pqsition for forming the WEB pad 8. Since the dicing line traverses the inside of the external lead-out electrode part 7, a crack in the external lead-out electrode part is stopped at the groove and does not reach the external lead-out electrode part beneath the region for forming the WEB pad. Since adhesion onto the external lead-out electrode part is not decreased, the W/B pad is bonded tightly to the glass substrate and not stripped off therefrom.</p> |
