| 摘要 |
PROBLEM TO BE SOLVED: To protect load short-circuiting by sealing a first chip resistor to a first conductive land on a metal substrate and sealing a second chip resistor to a heat sink that is essentially of the same size as the second chip resistor. SOLUTION: A chip resistor 3, that is mounted on heat sinks 1 and 2 is 3.6×2.5mm in size and is 0.4mm thick. The resistor 3 has three bonding pads 4, where two resistors of 0.44Ωare connected in parallel to form approximately 0.44Ω. The heat sinks 1 and 2 of Cu are 4.5mm (vertical)×5.5mm (horizontal)×2.5mm (thickness) and 13×13×3mm in size, respectively, and a load is short- circuited for 0.1 second as load short-circuiting conditions. In the case of the short-circuiting of load for approximately 0.1 second, the upper surface size of the chip resistor 3 and that of the heat sink can be essentially the same. And, by performing sealing to a heat sink which is of essentially the same size as the second chip resistor, the short-circuiting of load can be prevented.
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