| 摘要 |
PROBLEM TO BE SOLVED: To prevent the bonded sections of thin metallic wires provided near a semiconductor element having bump electrodes from being stripped off by a protective resin composed of silicone rubber. SOLUTION: After a first protective resin layer 5a composed of an epoxy resin is provided between the main body section 2a of a semiconductor element having bump electrodes 1 arranged on a circuit board 3 and the board 3, a second protective resin layer 6a composed of a polyimide resin is provided so as to cover the upper surface of the main body section 2a of the element 2 and the connecting sections of metallic thin wires 8. Then the circuit board 3 is positioned on a metallic supporting plate 11 and the substrate 3 is covered with a sealing resin 12 composed of an epoxy resin. The hardness of the first protective resin layer 5a is made higher than that of the second protective resin layer 6a. |
