| 摘要 |
<p>PROBLEM TO BE SOLVED: To adjust the internal pressure optimally and ease reuse and recycle processing. SOLUTION: This carrier box 11 is provided with a container body 13 in which a number of semiconductor wafers 12 are held and housed inside, a cover body 14 which keeps the inside of the container body 14 clean by covering in a state where the wafers 12 are housed within the body 13, and a gasket 15 formed of another member which are fitted between the bodies 13 and 14. The gasket 15 allows a gas to pass through between the inner and outer sides, so as to make the internal air pressure agree with the external air pressure, and it also limits passing of dust, etc. The gasket 15 is formed of porous material. Concretely, it is formed through foaming process by using a fluororesin or olefinic resin, etc.</p> |
