| 摘要 |
<p>PROBLEM TO BE SOLVED: To realize temperature distribution necessary for keeping plane uniformity of a sample to be processed. SOLUTION: A control part 9 allows a wafer to be sucked electrostatically to an electrostatic suction table and supplies a helium gas to cooling discs 3a, 3b and 3c from a helium gas supply part 8 through a gas supply pipe 14. The control part 9 activates driving motors 6a, 6b and 6c for elevation according to the temperature distribution data of wafer measured by a temperature sensor 10 and the position data from an encoder 7, so as to control the position and area of the cooling discs 3a, 3b and 3c which are brought into contact with the rear surface of the wafer. Thus, the wafer can be controlled at desired temperature distribution.</p> |
