发明名称 HYBRID INTEGRATED CIRCUIT DEVICE
摘要 <p>PROBLEM TO BE SOLVED: To package a power device on a flexible sheet by fixing the flexible sheet with its fixing hole and a first projection on a metal substrate, and bringing the flexible sheet into contact with a second projection on the metal substrate. SOLUTION: A substrate 10 is pressed from its rear surface to form projections 20 and 21 on a packaging surface of the substrate. A fixing hole 22 is provided on a flexible sheet 11 such that the projection 20 is inserted into the fixing hole 22. The projection 21 is provided in a region where a power device 17 is provided. The flexible sheet 11 is fixed with the projections, and is free from the metal substrate except the fixed portions. There is a predetermined interval between the flexible sheet 11 and the metal substrate 10 by the device packaged on the substrate. By this constitution, a heat sink 18 and the power device 17 are packaged on the flexible sheet 11.</p>
申请公布号 JPH10107206(A) 申请公布日期 1998.04.24
申请号 JP19960257095 申请日期 1996.09.27
申请人 SANYO ELECTRIC CO LTD 发明人 OTA SUSUMU;KUDO KIYOAKI
分类号 H05K1/16;H01L25/07;H01L25/18;H05K1/05;(IPC1-7):H01L25/07 主分类号 H05K1/16
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