发明名称 METHOD FOR MANUFACTURING MULTI-LAYER PRINTED WIRING BOARD, AND DEVELOPMENT PROCESSING JIG
摘要 PROBLEM TO BE SOLVED: To develop photosensitive resin layers formed on both surfaces of a substrate at the same time, with the substrate kept in an upright state, by spraying developer from both sides of the substrate at the same time, for preventing the occurrence of undeveloped area. SOLUTION: In manufacturing a multi-layer printed wiring substrate, when an inter-layer insulating material layer comprising a viahole opening of a photosensitive resin layer on both surfaces of the wiring substrate, the multi-layer printed wiring substrate is kept in an upright state, a development process is performed by spraying a developer to the both surfaces of the photosensitive resin layer at the same time. Thereby, with undeveloped area left, the photosensitive resin layers formed on the both surfaces of the multi-layer printed wiring substrate are developed uniformly at the same time.
申请公布号 JPH10107450(A) 申请公布日期 1998.04.24
申请号 JP19960257053 申请日期 1996.09.27
申请人 IBIDEN CO LTD 发明人 NODA KOTA;SAWA SHIGEKI
分类号 H05K3/06;H05K3/46;(IPC1-7):H05K3/46 主分类号 H05K3/06
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