| 摘要 |
PROBLEM TO BE SOLVED: To inexpensively provide a multi-layered wiring board for transmission of high-frequency signals, which can prevent deterioration of signal transmission characteristics. SOLUTION: The manufacturing method includes a step of forming a circuit pattern of layer 6, which is lower in dielectric constant than an insulating layer 8 on a metallic layer 5 bonded on a transfer sheet 4 and etching it to form a wiring circuit layer 7, a step of transferring on the insulating layer 8, a low- dielectric constant layer 6 and the wiring circuit layer 7, and a step of forming a low-dielectric constant layer 9, at least on the transferred wiring circuit layer 7 on the insulating layer 8. A plurality of wiring layers A, manufactured by the above steps, are laminated and integrally formed to obtain a multi-layered wiring board having the inner wiring circuit layer 7 sandwiched by the low- dielectric constant layers 6 and 9. |
