| 摘要 |
PROBLEM TO BE SOLVED: To prevent damages on the surface wiring layer of a silicon nitride wiring board and improve heat dissipation so as to improve heat dissipation of a ceramic wiring board, thin the board and improve its reliability. SOLUTION: A silicon nitride layer 4 is formed so as to cover at least a part of a surface wiring layer 2, except external contact 2a, for instance, on a silicon nitride wiring board 1 which has the wiring layer 2 at least on the surface of a silicon nitride substrate 3 with a heat conductivity of 40W/mK or more. The silicon nitride layer 4 is formed by applying silicon nitride paste on a conductive paste coating layer to be the surface wiring layer 2, except an area to be the external contact 2a, and by baking the silicon nitride paste simultaneously with a silicon nitride green sheet to be a silicon nitride board 3 and the conductive paste coating layer. |
