| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing an improved multi-layered printed wiring board, capable of solving a problem of roughening a complex resin surface of a resin layer for enhancing a bonding strength between the resin layer and metallic film (circuit) and a problem of deterioration in its working environment accompanying the roughening work. SOLUTION: The method of manufacturing a multi-layered printed wiring board, in which an insulating layer as a resin layer provided at least a surface of a core material of the printed wiring board and a conductive layer as a metallic film, are alternately formed, so that conduction between the conductive layers is established through conductive holes made in the insulating layers. It includes a step of coating thermosetting resin on a surface of the core material to form the resin layer, a step of thermo-compressing and bonding rough surfaces of the metallic foils on the resin layers and removing the metallic foils therefrom to form rough surfaces of the resin layers, and a step of the metallic films on at least parts of the exposed resin layers and subjecting it to a patterning process, to thereby form circuits on the resin layers. |
