| 摘要 |
PROBLEM TO BE SOLVED: To improve a rate of effective area of a semiconductor device. SOLUTION: In a semiconductor substrate, at least first and second semiconductor chips 61 and 81 wherein an active element is formed, and first and second external connecting means 62, 63, 82 and 83 which are provided on the first and second semiconductor chips and are electrically connected with an electrode pads are provided. The first and the second semiconductor chips 61 and 81 are adjacently arranged, the first and the second external connecting means 62, 63, 82 and 83 are arranged in the vicinity of both semiconductor chips, and the first and the second external connecting means and one of the major planes of the first and the second semiconductor chips are exposed to be fixed by sealing resin 100. |
