| 摘要 |
PROBLEM TO BE SOLVED: To improve the reliability of the connecting section between a semiconductor chip and a wiring board. SOLUTION: The front end section of a wire 34 is protruded from a capillary 32 by a prescribed length (A) and the front end section is expanded and the bottom face of the section is shaped to a flat surface by pressing the section against a bench 20 heated to a prescribed temperature (B). Then the shaped front end section of the wire 34 is bonded to the electrode 18 of a semiconductor chip 16 by thermocompression bonding (C) and a bump 40 is formed on the electrode 18 by cutting the wire 34 (D). After forming the bump 40, the front end section of the bump 40 is expanded by pressing a bump shaping tool 36 heated to a prescribed temperature against the front end section and the bump 40 is shaped to a hand drum-like shape having a constricted middle section (E). After forming the hand drum-shaped bump 40 on all electrodes of the chip 16 by repeating the above-mentioned treatment, the bumps 40 are bonded to the electrodes of a wiring board 42 by thermocompression bonding. |
