POLISHING DEVICE AND METHOD

摘要

PROBLEM TO BE SOLVED: To enable a wafer to be polished stably in the polishing amount, and in the uniformity within its surface by a method in which the polishing state of the wafer is monitored at regular intervals by the use of a monitoring wafer, and steps such as alternations in polishing conditions and replacement of a polishing pad are taper. SOLUTION: A polishing state-judging section 43 judges whether a polishing state index is within a tolerance limit. A temporary stop indicating section 44 stops a polishing device temporary when a polishing state index is out of a tolerance limit. A pad replacement judging section 45 judges whether a polishing pad is replaced or not based on the polishing state index. A pad replacement indicating section 46 indicates that a polishing pad is replaced when it is judged that a polishing pad should be replaced. A polishing condition setting section 47 sets up conditions for polishing a wafer.