| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for mounting an electronic component which solves pickup miss of a chip, when the chips of parts feeders arranged in parallel are simultaneously picked up with a plurality of nozzles of transfer heads. SOLUTION: Nozzle position data of a first nozzle 9a, a second nozzle 9b and a third nozzle 9c are previously found with a first camera, and data of a pickup position of a chip of a parts feeder 4 are found with a second camera. After the chips of the parts feeders 4 are simultaneously picked up with each nozzle 9a-9c, it is inspected whether or not there is pickup miss. If there is no pickup miss, a transfer head is moved above a substrate as it is, and the chip is mounted on the substrate. If there is a pickup miss, a pickup miss rate of the parts feeder 4 which has caused pickup miss is renewed, and pickup of the chip of the parts feeder 4 is attempted once more with the nozzle which has made the picking up. |
