发明名称 THERMALLY ISOLATED INTEGRATED CIRCUIT
摘要 Thermally isolated circuit formed on a semiconductor on insulator structure includes a semiconductor surrounded by a semiconductor outer portion with an insulator therebetween, a cavity formed in the underlying semiconductor substrate opposite to the island provides thermal isolation.
申请公布号 WO9816955(A1) 申请公布日期 1998.04.23
申请号 WO1997US17727 申请日期 1997.10.02
申请人 HONEYWELL, INC. 发明人 DRIES, MICHAEL, F.;ROISEN, ROGER, L.
分类号 H01L27/02;(IPC1-7):H01L27/02 主分类号 H01L27/02
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