发明名称 |
THERMALLY ISOLATED INTEGRATED CIRCUIT |
摘要 |
Thermally isolated circuit formed on a semiconductor on insulator structure includes a semiconductor surrounded by a semiconductor outer portion with an insulator therebetween, a cavity formed in the underlying semiconductor substrate opposite to the island provides thermal isolation.
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申请公布号 |
WO9816955(A1) |
申请公布日期 |
1998.04.23 |
申请号 |
WO1997US17727 |
申请日期 |
1997.10.02 |
申请人 |
HONEYWELL, INC. |
发明人 |
DRIES, MICHAEL, F.;ROISEN, ROGER, L. |
分类号 |
H01L27/02;(IPC1-7):H01L27/02 |
主分类号 |
H01L27/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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