| 摘要 |
PROBLEM TO BE SOLVED: To provide a cooling chamber which can cool a substrate sufficiently and rapidly. SOLUTION: A substrate 35 is cooled by a pair of cooling members adjacent to top and bottom surfaces of the substrate 35, preferably, by a cooling chamber utilizing a coupled clamshell-like member. The top surface should not be brought into direct contact with the cooling member, and an upper cooling member 38 can be brought close to the surface of the substrate 35 in a range of approx. 0.01 to 0.03 inches preferably. A lower cooling member 40 should be brought close to the bottom surface of the substrate, and preferably it is brought into contact therewith, or it can be brought close thereto in a range of approx. 0.01 to 0.03 inches. When the hot substrate 35 is enclosed by two cooling members 38 and 40, an inert gas is supplied into this enclosure at a pressure of 5 to 30Torr, permitting efficient thermal conduction from the substrate 35 to the cooling member. After the substrate 35 is cooled sufficiently, the members 38 and 40 are separated and a high-pressure gas within the enclosure is discharged and diffused in a gas occupying the remaining space of the cooling chamber. |
