| 摘要 |
<p>PROBLEM TO BE SOLVED: To efficiently manufacture a multichip module(MCM) by making it possible to accurately form adhesive layers on the electrode surfaces of chips having different sizes and, at the same time, to mount a plurality of chips having different sizes at once. SOLUTION: In a multichip mounting method, a plurality of adhesive-applied chips 1, on each of which a film-like adhesive layer 4 having the nearly same area as the electrode forming area of the chip 1 is formed on the electrode forming surface of the chip 1, is first obtained (1). Then the electrodes of the chip 1 to be connected are aligned with those on a substrate (2). After alignment, the chips 1 are electrically connected to the same substrate by heating and pressurizing the aligned electrodes of the chips 1 against the corresponding electrodes on the substrate. Then the electrical connection between the electrodes of the chips 1 and the electrodes on the substrate are inspected as necessary.</p> |
