| 摘要 |
PURPOSE:To load a semiconductor device, whose electrode is protruded from a side surface while being downward bent, by forming a projecting section on the semiconductor-device mounting surface side of a radiation fin proper and shaping a terminal, to which the electrode for the semiconductor device and an external circuit are connected, on the side of the projecting section. CONSTITUTION:Projecting sections 1c are shaped on the semiconductor-device mounting surface side of a radiation fin proper 1. Terminals 5 to which electrodes 2a for a semiconductor-device and external circuits are connected are formed on the sides of the projecting sections 1c. Power modules 2 in which the electrodes 2a are protruded from side surfaces and bent downward are loaded on the upper surfaces of the projecting sections 1c for the main body 1, and the electrodes 2a for the modules 2 are inserted into socket sections 5a shaped on the sides of the projecting sections 1c. The modules 2 are fixed to the upper surface of the main body 1 by screws 7. |
