发明名称 |
Electronic device package and method for forming the same |
摘要 |
An electronic device package (10) is resistant to rupture at high temperatures. The electronic device package (10) includes a cap (14) having side-walls (18) coupled to a support structure (11) via an adhesive (15). The cap (14) is permeable to gases including water vapor. The side-walls (18) of the cap (14) are made of a porous ceramic material which absorbs a portion of the adhesive (15) via capillary action while curing the adhesive (15).
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申请公布号 |
US5742007(A) |
申请公布日期 |
1998.04.21 |
申请号 |
US19960695813 |
申请日期 |
1996.08.05 |
申请人 |
MOTOROLA, INC. |
发明人 |
KORNOWSKI, ROBERT R.;MISSELE, CARL;RICE, THOMAS W. |
分类号 |
H01L21/68;H05K5/00;(IPC1-7):H05K5/06 |
主分类号 |
H01L21/68 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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