| 摘要 |
A method of forming a z-axis interface with a device having a first electrically conductive pad thereon wherein a layer of resilient electrically insulating material, capable of being made rigid, preferably a thermoplastic polymer or a b-stage thermosetting polymer, is formed over the first pad. A via is then formed in the electrically insulating material extending to the first pad. A layer of electrically conductive material, preferably gold, is then formed on the sidewalls extending to the pad and out of the via. A second electrically conductive pad is then applied under pressure to the electrically conductive material extending out of the via to deform the electrically conductive material into the resilient electrically insulating material. The electrically insulating material is then caused to become rigid. In accordance with a second embodiment, a free standing interconnect structure is provided by providing a removable base, forming a patterned electrically conductive layer on the base, forming a layer of resilient electrically insulating material, capable of being made rigid, and having a via with sidewalls extending therethrough secured to the electrically conductive layer, forming a layer of electrically conductive material on the sidewalls extending out of the via and over the electrically insulating material and removing the removable base.
|
