| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat-sealing resin composition having good low- temperature heat-sealing properties, moldability and blocking resistance. SOLUTION: This thermoplastic resin composition comprises the following components (a), (b), (c), and (d) (where these five components amount to 100wt.%): (a) 20-70wt.% of an ethylene-α-olefin copolymer resin having a density of <=0.915 and a crystallinity of >=30%, (b) 10-60wt.% of an olefinic elastomer having a crystallinity of <=30%, (c) 5-40wt.% of a modified olefin polymer prepared by graft polymerization of 70-5wt.% of vinyl monomers onto 30-95wt.% of an olefinic polymer, and (d) 5-30wt.% of a tackifier.
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