CHAMFERING AND SURFACE POLISHING DEVICE OF SEMICONDUCTOR WAFER,申请号JP19970114887-传众专利搜索

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发明名称	CHAMFERING AND SURFACE POLISHING DEVICE OF SEMICONDUCTOR WAFER
摘要
申请公布号	JPH10100051(A)	申请公布日期	1998.04.21
申请号	JP19970114887	申请日期	1997.05.02
申请人	MITSUBISHI MATERIALS CORP;MITSUBISHI MATERIALS SHILICON CORP	发明人	KAWAGUCHI AKIRA;KIMURA SHIGERU;YANOO AKIHITO;TAKADA MASAO;TSURUTA SHOJI;KUMABE SHIGEO
分类号	B24B9/00;H01L21/304;(IPC1-7):B24B9/00	主分类号	B24B9/00
代理机构		代理人
主权项
地址

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