| 摘要 |
A method and device for accurately mounting a probe in a probe card and for maintaining correct location of the probe tip as the probe is used for electronic testing of an IC pad. A membrane having a slot is attached to a support structure of a probe card. The probe tip is inserted into the slot and the probe is affixed to the membrane at the edges of the slot using silicon rubber. The probe is then mounted in the support structure which has a groove for receiving the probe. A distal end of the probe is bonded to the walls of the groove so that the probe is free to move vertically in the groove, but constrained from moving laterally to prevent side-buckling. The membrane and silicon rubber hold the probe tip in proper location during thermal treating of the probe card assembly. Once mounted in the probe card by this method, the probe and probe tip will maintain proper location as they are used for electronic testing of an IC pad. During testing, the probe tip and attached membrane are deflected from their initial position by force of contact with the IC pad. Upon completion of the test, the contact force is removed from the probe tip. The elasticity of the membrane causes the membrane and the attached probe tip to return to their initial position, ensuring that the probe tip is in the proper location for the next test.
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