CHAMFERING AND SURFACE POLISHING DEVICE OF SEMICONDUCTOR WAFER

摘要

PROBLEM TO BE SOLVED: To allow to carry out a good polishing process generating little dam age to a semiconductor wafer, as well as to allow to install a polishing cloth to a polishing drum easily and securely. SOLUTION: In this chamfering surface polishing device of a semiconductor wafer, a polishing cloth 111 is slid in the pressing condition to polish the chamfering surface, as well as a grinding fluid is fed to the chamfering surface which is formed on the peripheral edge of the semiconductor wafer W. And a polishing drum 90 in which the polishing cloth 111 is provided on the outer peripheral surface of a main body wheel 110 which is held rotatable, and the chamfering surface is polished by abutting the polishing cloth 111 to the chamfering surface in the rotating condition; and a drum driving means to rotate the polishing drum 90; are provided, and the polishing cloth 111 is formed in a cylindrical form by laminating plural circular ring form of unit polishing cloths 111a on the main body wheel 110 in the outer inserting condition.