| 摘要 |
A projection exposure method is provided for transferring a pattern formed on a mask through a projection optical system onto a plurality of shot areas on a photosensitive substrate respectively. Correction for inclination of the entire photosensitive substrate (global leveling) is performed during movement of the substrate for positioning for a first exposure shot (step 110). Leveling at each exposure position (chip leveling) is performed after positioning for each exposure shot (step 112), and then exposure is performed. Therefore, the leveling operation is divided, the correction amount for leveling at each exposure position is small, and the leveling is completed in a short period of time at the exposure position. Positional adjustment for the substrate in a direction of an optical axis is performed during movement of the substrate to a shot to be subsequently exposed. The leveling and the focusing can be accurately performed at each exposure shot position without extremely lowering the throughput. The method is also is applicable to exposure methods of the step-and-repeat system and the slit scan system.
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