发明名称 |
High thermal conductivity substrate and the method of brazing a cap thereto |
摘要 |
Temperature gradients between a ceramic substrate of high thermal conductivity and the braze materials used to attach a metallic device such as a cap are reduced by using an embedded internal heat source in the substrate to minimize the thermal gradient, thereby minimizing the stresses that can result in substrate cracking when a cap is brazed onto the substrate.
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申请公布号 |
US5742021(A) |
申请公布日期 |
1998.04.21 |
申请号 |
US19960695433 |
申请日期 |
1996.08.12 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
ECONOMIKOS, LAERTIS;HANNON, ROBERT;SURPRENANT, RICHARD P.;VANDUYNHOVEN, THOMAS |
分类号 |
H01L21/50;(IPC1-7):B23K9/10 |
主分类号 |
H01L21/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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