Hot melt adhesive composition comprising an acidic ethylene polymer and a polyamide

摘要

A hot melt adhesive composition comprising a compatible mixture of: (a) an acidic ethylene polymer having an acid number ranging from about 3 to about 80 and (b) a polyamide having an amine number ranging from about 70 to about 400, together with a minor effective amount of a tackifying agent; components (a) and (b) being present in a relative proportion by weight ranging from about 80:20 to 20:80. An encapsulation method utilizing said adhesive is also described.