| 摘要 |
A flat panel apparatus includes a faceplate with a backplate interior side, a backplate with a backplate interior side, and sidewalls positioned between the faceplate and backplate, all in combination forming an enclosed sealed envelope. At least one spacer is positioned in the envelope. The spacer includes a spacer backplate face, with a periphery, and it is positioned adjacent to the backplate interior side. The spacer also includes a spacer faceplate face, with a periphery, and it is positioned adjacent to the faceplate interior side. A first conductive layer, metallization, is applied to substantially cover the entire spacer backplate face to its periphery. A second conductive layer, metallization, is applied to substantially cover the entire spacer faceplate face to its periphery. A plurality of spacers can be positioned in the sealed envelope, and the spacers can be in the form of walls, posts, or wall segments. In place of the conductive layers at the faces, each spacer can include a plurality of electrodes that extend along spacer sidewalls. In this embodiment, the spacer has a sidewall electrode that is positioned sufficiently close to each face surface as to create good ohmic contact between the face surface and the respective faceplate or backplate interior side.
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