| 摘要 |
Proposed is a novel heat-conductive sheet used for the transfer of heat from a heat-generating device, e.g., semiconductor devices, to a heat sink member mounted thereon by intervening therebetween. The heat-conductive sheet is a laminar body comprising an aluminum foil and a layer of a gel-like composite material consisting of a cured organopolysiloxane as the matrix phase and inorganic heat-conductive particles as the dispersed phase in the matrix. The gel-like heat-conductive layer is specified by a specific heat conductivity in the range from 0.001 to 0.005 calorie/cmxsecondx DEG C. and a specific consistency defined by the value of the +E,fra 1/4+EE -cone penetration in the range from 10 to 80 (x+E,fra 1/10+EE mm) at 25 DEG C. according to JIS K 2920.
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