| 摘要 |
An method and apparatus for forming adhesive and solder pads on a printed circuit board to surface mount electrical components to the board. In accordance with an embodiment of the invention, a solder paste is deposited onto the printed circuit board through a first stencil that has a plurality of first openings. The solder paste forms a plurality of solder pads on the board. A second stencil is then positioned on the printed circuit board. The second stencil has a plurality of second openings, and a recess in its bottom face configured to receive the plurality of solder pads. After the second stencil is positioned on the printed circuit board so that the solder pads are received in the recess on the bottom face of the second stencil, an adhesive material is deposited onto the board through the second openings of the second stencil to form a plurality of adhesive pads on the board.
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