| 摘要 |
A description is given of radiosensitive (radiation-sensitive) compositions based on water as solvent and/or dispersion medium for their components. The compositions contain as constituents at least 10 - 50% by weight of water-soluble and/or water-dispersible, solid, crosslinkable, film-forming polymers as binder, 4 - 50% by weight of water-soluble and/or water-dispersible photopolymerisable acrylate and/or methacrylate monomers and/or corresponding oligomers, 0.1 - 10% by weight of water-soluble and/or water-dispersible photoinitiator compounds for the photopolymerisable acrylate and/or methacrylate monomers and/or corresponding oligomers, and, if the binder contains polymers which are not self-crosslinking, 2.5 - 40% by weight of water-soluble or water-dispersible crosslinking agents for the binder polymers as thermal hardener, selected from the group comprising epoxy resins, melamine resins and blocked polyisocyanates. Preferred are compositions comprising acrylate and methacrylate polymers or copolymers containing carboxyl groups as binders, in which carboxyl groups are each reacted with ammonia and/or certain amines to make the binder water-soluble. The compositions mentioned are patterned by photolithography and are particularly suitable as a solder resist. |
