| 发明名称 |
Method and apparatus for sticking an insulating film to a lead frame |
| 摘要 |
<p>A method for punching an insulating film is composed of using plural divided punches having a clearance between each two of the divided punches. The clearance absorbs thermal expansion of the divided punches caused by receiving a heat from a heater. A punched insulating film is stuck to a lead frame by being pressed between the divided punches and the heater.</p> |
| 申请公布号 |
SG48170(A1) |
申请公布日期 |
1998.04.17 |
| 申请号 |
SG19960007580 |
申请日期 |
1994.05.12 |
| 申请人 |
HITACHI CABLE, LTD |
发明人 |
KAWAMURA TOSHIO;SUZUMURA TAKASHI;AIDA MAKOTO;SUGIMOTO HIROSHI;SHIGEHARU TAKAHAGI |
| 分类号 |
H01L21/00;H01L21/48;H01L23/495;(IPC1-7):H01L21/00 |
主分类号 |
H01L21/00 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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